ADI Engineering’s strategically located factories deliver trusted manufacturing solutions across all volumes, with intense focus on time-to-market and minimizing procurement, materials management, and manufacturing costs. Maximum flexibility is achieved through company-wide scheduling and communications systems that position customer need as the focal point for all business operations.
All ADI designs are covered by our groundbreaking Open IP model. By restoring customer control of product life cycles lost in the embedded market’s rapid transition to COTS technologies, Open IP delivers unique advantages in supply chain control, assured long-life production, and hedging against future pricing, quality or leadtime issues.
Exceptional people, skills, and high technology are the foundation of ADI’s manufacturing group. Our manufacturing teams have extensive experience with high layer count, MicroBGA, Fine Pitch- and BGA-intensive designs, POP technology, and when integrated with our innovative design solutions, they produce accurate, cost-effective, and quality products.
- Fine Pitch (12 mils) and BGA placement and repair
- Paste In Hole
- Pin In Hole technology
- Double-sided mixed technology
- No clean process
- Water wash process
- Flex assembly
- Conformal coating
- Large Complex PCAs
- High part count > 3,000
- High layer count Printed Circuit Card
- BGA-intensive – placement and repair
- Micro – BGA and CSP
- Paperless shop floor documentation system
- Design for Manufacturing reviews Placement Capabilities
- .4 mm Pitch for QFP
- 0201 Chip Component
- up to 2” square BGA
- 1500 IO BGA